Laird Tflex HD700 Series Silicone Based Thermal Gap Filler
Best thermal interface for high-performance industrial and automotive cooling applications.
The Laird Tflex HD700 Series is a silicone-based thermal gap filler engineered for superior heat transfer while minimizing mechanical stress on sensitive components. This ceramic-filled pink sheet material achieves a high thermal conductivity of 5.0 W/mK, ensuring low thermal resistance in demanding applications. It is designed to offer excellent surface wetting and low pressure versus deflection characteristics. Environmentally conscious, this versatile solution meets critical regulatory standards like RoHS and REACH, making it suitable for diverse sectors including Automotive, Telecom, and Industrial systems.
$26.49
Owner Satisfaction
4.7
/ 5
Category Rank
152
/ 3605
#152 in Computer System Cooling Parts
Price vs Category Average
-82%
Below average
Thermal Conductivity
5.0
/ W/mK
Who it's for
- Professionals requiring long-term thermal stability and electrical safety
- System builders needing efficient heat dissipation for high-performance components
- Engineers protecting delicate circuits from mechanical stress during assembly
Who should skip it
- Manufacturers of sensitive optical equipment or precision electronics
- Budget-conscious builders looking for cost-effective thermal solutions
- Technicians frequently performing repairs or component upgrades
Performance breakdown
Thermal Conductivity
High 5.0 W/mK rating handles demanding heat dissipation with ease.
Component Protection
Low-stress deflection prevents mechanical damage to delicate board components.
Surface Wetting
Excellent interface contact minimizes resistance for optimal heat transfer efficiency.
Thermal Stability
Wide operating range ensures reliability in extreme industrial temperature environments.
Regulatory Compliance
Fully RoHS and REACH compliant for global industrial and automotive integration.
Application Versatility
Flexible sheet format adapts well to diverse hardware assembly requirements.
Key Specs
Thermal Conductivity
5.0 W/mK
Construction
Ceramic filled silicone sheet
Color
Pink
Temperature Range
-50 to 200°C
Density
3.3 g/cc
Hardness
54 Shore 00
UL Flammability Rating
V-0
Dimensions
9" x 9" Sheet
Features
- High thermal conductivity of 5.0 W/mK
- Low stress on components during mounting
- Excellent surface wetting minimizes contact resistance
- Option for enhanced electrical isolation
- Environmentally friendly and compliant solution
- Minimizes board and component mechanical stress
- Available in various thicknesses up to 0.06"
- Tear resistance option available
What customers say
Customers highly value the Laird Tflex HD700 for its exceptional thermal performance and superior material compliance. Reviewers consistently note that its softness allows it to conform perfectly to uneven surfaces, maximizing contact and ensuring efficient heat transfer for critical components. This compliance is a key feature, delivering reliable, measurable temperature reductions compared to standard pads. While the product commands a premium price, users agree the performance justifies the investment for mission-critical systems where thermal headroom is essential. The material’s high tackiness requires careful handling during installation. Overall, the consensus points to the HD700 as a highly reliable, top-tier solution when performance outweighs cost considerations.
Know before you buy
The Tflex HD700 series offers a high thermal conductivity of 5.0 W/mK while maintaining a low Shore 00 hardness. This combination allows for excellent surface wetting and heat transfer without applying excessive mechanical pressure to delicate board components.
Yes, the material is rated for a wide operating temperature range of -50°C to 200°C. This makes it suitable for demanding applications in automotive, telecom, and industrial systems where heat fluctuations are common.
The Tflex HD700 is a ceramic-filled silicone sheet designed to provide effective thermal management while offering electrical isolation. It is an ideal choice for applications where you need to bridge a gap between a heat source and a heatsink without creating an electrical short.
You should consider the gap size between your component and the cooling solution, as this material is available in thicknesses up to 0.06 inches. Its low pressure versus deflection characteristics mean it will conform well to uneven surfaces, but you should ensure the thickness matches your specific clearance requirements.
Yes, the Tflex HD700 is RoHS and REACH compliant and carries a UL 94 V-0 flammability rating. These certifications ensure it meets strict safety and environmental standards for use in a variety of electronic devices.
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